Our Facility

Over 6,000 Sq. Ft. of Cutting Edge Manufacturing Space

In 2005, Youngtronics moved into a 6,000 sq. ft. facility located in Wixom, Michigan, USA.
We conduct our full-service contract manufacturing operations in a static-free, climate and humidity controlled building.
We produce and ship locally out of our Wixom, MI production facility, with excellent follow-up and immediate customer response to any inquiries.
Our facility’s two SMT production lines have supported PCB assembly and testing since 2005.
We are well-established with access to the latest infrastructure and technology.
We use a computer controlled Real-Time Inventory System.
Our machines and equipment are highly rated in the industry.

Our Machines and Equipment

Product Lifecycle Management System (PLM)
Philips Topaz Gem Pick & Place Machine
Electrovert Bravo 4050 Reflow
Hollis Future1 Wave Solder Machine
Electrovert Econopak II
Electrovert Selective Soldering System
Essemtec SP 200 Automatic Screen Printer
Auto Align and Optical Inspection (AOI) Machine
- We use an Automated Optical Inspection (AOI) machine in our build process. This AOI machine is used for Small Prototype runs, through larger production runs, and eliminates the subjectivity and variability occasionally associated with manual visual inspections. It will inspect component placement, orientation, and polarity, and it ensures component and solder quality.
Mantis Vision System

PCB Assembly Equipment

SMT Equipment
Through-Hole Assembly
Soldering Equipment
Components Preparation
Ultrasonic Cleaning Equipment
Computerized Testing and Programming

Technologies and Capabilities

Our automatic Surface Mount and Through-Hole production lines ensure quality and provide a quick turn-around, whether your needs include prototypes or full production.

Thru – Hole PCB Assembly
Surface Mount Technology (Down to 12 mm Ultra-fine Pitch)
Mixed Technology
BGA and Micro-BGA
Lead-Free RoHS compliant
100% Testing
Programming
Test Jigs and Fixtures
Component Kit or Turnkey Manufacturing
Prototyping & High Volume
Heat Bonding

Chip Scale Packaging
Flip Chips
Flex Circuits
Thin Rigid Substrates
Double Sides and Intrusive Reflow Process
No Clean and Water Soluble Soldering Capabilities
In Circuit Testing
Functional Testing
Cable Fabrication
Electromechanical
PCMCIA
Real Time X-Ray

Testing Capabilities and Solutions

Our final test facilities ensure that completed assemblies undergo Functional Testing, RF Testing, and Burn-In and Final Box Testing. We also do Performance Testing and troubleshooting.